Lam Capital Venture Competition

May 21, 2026

Fremont, CA 

Building the AI Backbone

DSC01863

Lam Capital is proud to host the 4th Lam Capital Venture Competition in 2026, spotlighting AI enablement. This premier event brings together industry leaders, academic pioneers, top tier VCs & CVCs, and visionary startups to explore how semiconductors are driving the AI revolution, and how AI is transforming the future of semiconductor and advanced manufacturing technologies.

Submit Pitch Deck
Event Registration

Featured Speakers

Join thought leaders from top tech companies, research institutions, and venture capital firms as they share insights on:
  • How Advanced Packaging enables AI revolution 
  • Collaborating to innovate: translating research into impact
 
(Speaker lineup to be announced)

Startup Competition

Are you building the next breakthrough in AI-enabled tech? Apply to pitch your startup to a panel of expert judges and investors. Selected teams will compete live for $250,000 investment, mentorship, and strategic partnerships.
  • Applications open now
  • Early-stage and growth-stage startups welcome

We are looking to engage with startups that have products, and solutions in these areas:

  • Advanced Packaging & Heterogeneous Integration
  • Robotics for Autonomous Manufacturing
  • Compound Semiconductor & CMOS Integration
  • High-Bandwidth Interconnects
  • Integrated Optics & Photonics
  • 2D Materials and Novel Processes
  • Smart Tools, Sensors & Digital Twin
  • AI for Process and Manufacturing Control
  • AI for Materials Design & Discovery
  • AI for Physical Design & Simulation
  • Physical AI
  • Quantum Computing
  • Higher Manufacturing Productivity Solutions
  • Sustainable Technologies

Stay Informed

Sign up to receive updates on speakers, startup applications, and registration.

Company contact(Required)
Consent(Required)
This field is for validation purposes and should be left unchanged.