Fringe Metrology

As chips move to 3D stacking, tiny alignment errors, surface defects, and warpage compounds—driving yield loss and limiting scalability. Fringe Metrology is building a breakthrough inspection layer powered by a novel structured light architecture to solve this bottleneck. Delivering orders-of-magnitude improvements in resolution, noise resistance, and dynamic range, our technology enables simultaneous die warpage measurement and macro defect detection—unlocking the high-volume yields needed for the next generation of advanced packaging.

Joel Berkson

Dr. Joel Berkson is the CEO and founder of Fringe Metrology, developing next generation inspection systems. He earned his Ph.D. from the University of Arizona’s Wyant College of Optical Sciences, where his innovative work in scalable telescope systems and metrology earned him Tech Launch Arizona’s Student Innovator of the Year award in 2022. Since then, his full efforts are toward commercializing Fringe Metrology’s novel metrology techniques for semiconductor inspection.