Multibeam

Multibeam has re-innovated e-beam lithography to enable cost-effective production of leading-edge semiconductors for advanced packaging, photonics, rapid prototyping, and other special applications.
It is the industry’s only maskless multi-column e-beam platform that offers full-wafer direct write patterning capabilities with fine resolution in a modular architecture that is optimized for scale. The fully automated system features multiple miniaturized e-beam delivery columns and advanced algorithms that enable precision patterning with fab-level productivity.
Innovated by patterning and wafer fab equipment experts, Multibeam systems empower IC leaders to make patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time-to-market advantages.

Ted Prescop

As Vice President of Technology at Multibeam, Ted Prescop leads the technology and application development of Multibeam’s proprietary MEBL systems. He has experience in semiconductor chip design, process development, and metrology at fabless foundries, KLA-Tencor and Veeco. Mr. Prescop holds B.S. and M.S. degrees in Engineering Physics and Mechanical Engineering, respectively, from UC Berkeley.